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iii

Declaration of RoHS Compliance

This product has been designed and manufactured in compliance with Directive 2002/95/EC

of the European Parliament and the Council on restriction of the use of certain hazardous

substances in electrical and electronic equipment (RoHS Directive) and is deemed to comply

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Committee (TAC) as shown below:

Substance

Proposed Maximum

Concentration

Actual Concentration

Lead (Pb) 0.1% < 0.1%

Cadmium (Cd) 0.01% < 0.01%

+H[DYDOHQW&KURPLXP&U

) 0.1% < 0.1%

Polybrominated biphenyls (PBB) 0.1% < 0.1%

Polybrominated diphenyl ethers (PBDE) 0.1% < 0.1%

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Directives as noted below:

([DPSOHVRIH[HPSWHGFRPSRQHQWVDUH

1. /HDGLQJODVVRIFDWKRGHUD\WXEHVHOHFWURQLFFRPSRQHQWVÀXRUHVFHQWWXEHVDQGHOHF-

tronic ceramic parts (e.g. piezoelectronic devices).

2. Lead in high temperature type solders (i.e. lead-based alloys containing 85% by weight or

more lead).

3. Lead as an allotting element in steel containing up to 0.35% lead by weight, aluminium

containing up to 0.4% lead by weight and as a cooper alloy containing up to 4% lead by

weight.

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